H Polyimide film eng

H Polyimide film
The polyimide film is a common polyimide film achieved by polycondensation of PMDA and ODA in strong polar solvents and through the process of forming film and imine treatment at high temperature, which possesses excellent physical, chemical, and electrical properties, atomic radiation resistant, solvent resistant, low & high temperature resistant. It performs successfully in the wide range of temperatures as low as -269ºC/-452F and as high as 260ºC/500F. Because of its unique excellent properties, it is the most ideal choice in many applications.
Product No.:F01 F0125/F0150/F0175/F01100/F01125/F01150/F01175/F01200/F01225/F01250
Characteristic:
Property Name												General Table of properties
Appearance												Transparent or semi-transparent golden film with smooth and flat surface and without any needle cavities, bubbles or electrically conductive impurities.
ThicknsNominal(μm）	25		50			75			100		125		150		175			200			225		250
Thickness Tolerance (μm)	+4		+6			+7			+8		+10		+8		+10			+12.5			+15		+15
-3		-5		-6			-6			-7		-8		-10			-12.5			-15		-15
Density(g/cm 3)												1.42±0.02
Max. Width (mm）	1040		1020			920			920		920		520		520			520			520		520
Tensile Strength												MD:135（1350） TD:115(1150)
MPa (kgf/cm2) ≥
Elongation								40.00								60.00
at Rupture （％）≥
Dielectric Strength,（MV/m） ≥					180.00							160.00							120.00
Shrinkage（%）≤												150。C :1.0 400。C:3.0
Surface Resistivity												1.0×1013
（Ω）≥
Volume Resistivity （Ω. cm） ≥												1.0×1015
Dielectric Constant												3-4